Government Allows Investment in Low-level Semiconductor Packaging and Testing, 
and Small-size Panel Production in China

       According to the announcements issued simultaneously by the Ministry of Economic Affairs and Mainland Affairs Council on April 27, investment by Taiwanese companies in low-level semiconductor packaging and testing operations as well as production of small-size display panels in mainland China will be opened up in order to strengthen the competitiveness of the Taiwanese enterprises.

　　Under the relaxed rules, Taiwanese manufacturers will be allowed to invest in wire bond chip packaging and electronic testing, as well as in the production of display panels up to four inches in size (used mainly in cell phones, PDAs, and digital cameras) in the mainland.

　　For further information, please go to one of these websites: http://w2kdmzl.moea.gov.tw/user/news/detail-1.asp?kind=1&id=11112, or http://www.mac.gov.tw/big5/cnews/ref950427.htm.

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